PCB Design Test
A conductor in a printed circuit should be considered a transmission line if its length l (in meters) is
A standard hole(0.8mm) in a PCB design is represented by which symbol.
All the processing steps for manufacturing ultra thin foils except ____are conventional.
By which material is the transfer of the conductor pattern from the film master on to the copper clad base material done?
By which material is the typical resin/filler laminate of ordinary PCBs replaced in metal core boards?
Copper plating is done in multilayer boards to _____.
Crosstalk is much less dangerous in which of the following.
Current spikes in TTL circuit boards can be eliminated by which technique.
Etch back is a technique by which ______.
Fabrication of PCBs for microwave use requires
Ferric chloride is used in PCB designing as a/an _____.
For the etching process, the temperature should preferably be around
For TTL , we require a wave impedance of_____.
How much copper surface is reserved on multilayer boards for the solderability test?
If Ohmic losses are neglected, the wave impedance Zw in a homogenous material can be calculated by using the formula.
If a ground line is kept close to a signal line, crosstalk would be _____.
In fast signal or high – speed logic circuits , the conductors are considered to be _____.
In the component code used in the circuit diagram, by which letter, according to ANSI, is an integrated circuit represented?
In the layout approach, a 'Puppet' is used for_____.
In which of the following processes is porosity test done?
In which of the following ways can the required quantity of heat for the melting of the solder be supplied?
It is a common experience of electronic circuit designers that at high frequency{>10 MHz), amplifiers behave as _____.
Large values of wave impedance call for _____.
Multiwire boards are used in
On a PCB, the low power part and the high power part have to be spread sufficiently to avoid _____.
Parasitic effects influence the working of a PCB.
Polymeric materials exhibit a very high resistance to
Removing the resists from the board in photo printing is called
Screen printing is used in _____.
Self soldering or soldering generally implies that the joining process occurs at temperatures below
The absolute dimensional accuracy of a film master is determined by
The analog and the digital circuit on the same PCB should have _____.
The biggest disadvantage of flexible PCBs is that
The biggest problem associated with striplines and microstrip lines is the
The dielectric constant of any material is also referred to as _____.
The fundamental principle of electrolysis is understood from
The inks used in screen printing are mostly
The microstrip line is derived from a _____.
The skin-effect losses are sometimes also called
The volume resistivity of a laminate is given by
To overcome the motorboating effect, we must _____.
To reduce the skin-effect losses, what is required to be done.
Ultra thin copper foil has a range of thickness varying from
Under etching can be minimized by keeping the etching time _____.
Under which of the following conditions is a multilayers board used?
What is hot air leveling used for?
What would be the simplest and most suitable remedy for electro-magnetic coupling between two wires?
When two transmission lines are placed close to each other, they are said to be coupled. This coupling can be used to built
Which size of rack is used as a standard rack in PCB design?
Which of the following can be called multilayer construction?
Which of the following is a base material used in the manufacturing of flexible PCBs?
Which of the following is a category of dry film resists?
Which of the following is a characteristic parameter of a photographic material?
Which of the following is a coating process for wet film resists?
Which of the following is a design constraint for the design of the flexible PCBs?
Which of the following is a disadvantage of a solder mask?
Which of the following is a mechanical machining operation on PCBs?
Which of the following is a solderability test method?
Which of the following is a technique for the generation of the circuit pattern on metal core boards?
Which of the following is a type of soldering fluxes?
Which of the following is not a basic ingredient of a copper clad laminate?
Which of the following is not a film used in PCB design?
Which of the following is not a machine cleaning process for boards?
Which of the following is not a physical characteristic of a copper clad laminate?
Which of the following is not a solder alloy?
Which of the following techniques is used in mass soldering?
Which of the following tests is done for quality control for multilayer boards?
Which one of the following is not a plating technique?